Vacuum Assisted Reflow 在線(xiàn)式真空回流爐


Heller Industries has developed a vacuum module that inserts directly in its reflow oven line to meet rising demand of high volume, void free, automated inline soldering. This vacuum assisted reflow has been shown to reduce the voids in a solder joint by 99% and allows thermal profiles to be directly ported from non-vacuum reflow applications to
achieve low COO and high UPH.

Features 主要特點(diǎn)
Heller在線(xiàn)式真空回流爐可實(shí)現真空焊接的自動(dòng)化規模量產(chǎn)，降低生產(chǎn)成本；
內置式真空模組，分五段精準抽取真空，實(shí)現無(wú)空洞焊接 (Void < 1％)；
可直接移植普通回流爐的溫度曲線(xiàn)，曲線(xiàn)方便可調。
? Applies multi-zones to suit various thermal profile requirements
 多溫區設計，更多溫控點(diǎn)，滿(mǎn)足不同溫度曲線(xiàn)要求
? Able to achieve < 1% total void area spec
 有效消除空洞，總空洞面積可控制在1%以下
? Provides optimized cycle (average 30~60s) to achieve high UPH
 高效生產(chǎn)能力，平均生產(chǎn)節拍在30~60秒
? Utilizes advanced pumping package for fast pump down time
 高效無(wú)油真空泵機組，可實(shí)現最短降壓時(shí)間
? Adopts high efficient flux collection system to eliminate flux condensation

 高效助焊劑回收系統，預防助焊劑殘留